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8 attentions to the PCB stack design
Source:Original | Author:Calio Hunag of C&T RF Antennas Inc | Publish time: 2019-10-26 | 444 Views | Share:

One of the most fundamental issues to consider when designing a PCB (printed circuit board) is how many wiring layers, ground planes, and power planes are required to implement the functions required by the circuit, while the wiring layers, ground planes, and power supplies of the printed circuit board The determination of the number of layers in the plane is related to circuit function, signal integrity, EMI, EMC, manufacturing cost and the like. For most designs, there are many conflicting requirements for PCB performance requirements, target cost, manufacturing technology, and system complexity. PCB stack design is usually determined by considering various factors. High-speed digital circuits and RF circuits are usually designed in a multi-layer board.

The following are the eight principles to be aware of in cascading designs.

Layering

In a multilayer PCB, a signal layer (S), a power (P) plane, and a ground (GND) plane are usually included. The power plane and ground plane are typically undivided solid planes that provide a good low impedance current return path for the current of adjacent signal traces. The signal layer is mostly located between these power or ground reference plane layers, forming a symmetrical stripline or an asymmetric stripline. The top and bottom layers of a multilayer PCB are typically used to place components and a small number of traces. These signal traces are not required to be too long to reduce direct radiation from the traces.

2. Determine the single power reference plane (power plane)

The use of decoupling capacitors is an important measure to address power integrity. Decoupling capacitors can only be placed on the top and bottom layers of the PCB. The traces, pads, and vias of the decoupling capacitors will seriously affect the effect of the decoupling capacitors. This requires that the traces connecting the decoupling capacitors should be designed to be as short and wide as possible, and the wires connected to the vias should also be Keep it as short as possible. For example, in a high-speed digital circuit, the decoupling capacitor can be placed on the top layer of the PCB, the second layer is assigned to the high-speed digital circuit (such as the processor) as the power layer, and the third layer is used as the signal layer, and the fourth layer is used. Set to a high speed digital circuit board.